The major areas of activity in the flexible and stretchable electronics solicited and expected at this symposium include but are not limited to:


  • Soft and bio-inspired materials: New properties and functions enabled by deformation or soft materials
  • 2D materials and devices: Synthesis and electronic and optoelectronic applications
  • Mechanical design: Mechanics and reliability
  • Advanced manufacturing: Advanced Printing, IC packaging, Transfer Printing
  • Applications: Wearable electronics, Health care, Compliant energy sources, Flexible display, Smart skin, Soft robotics
  • Instrumentation 


Presentation and Recommendation

High quality papers from this symposium will be selected to be published in a special issue of MDPI

Micromachines Journal

About ISFSE and IWSMM

​​​​​The 5th International Symposium of Flexible and Stretchable Electronics 2019  The 5th International Workshop on Soft Machines and Mechanics 2019

 


Southern University of Science and Technology

Shenzhen, Guangdong, China​ | June 29th - June 30th, 2019

Upcoming Date

06.01.2019 ​| ​Abstract Submission Deadline

06.15.2019 ​| Acceptance Notification Deadline

06.01.2019 ​| Hotel  Reservation Deadline

06.09.2019 | Early Registration Deadline

06.29 - 06.30 2019 ​| Conference date


★  06.12.2019 | Poster Submission Deadline



Files