​​​​​The 5th International Symposium of Flexible and Stretchable Electronics 2019  The 5th International Workshop on Soft Machines and Mechanics 2019


Upcoming Date

Southern University of Science and Technology

Shenzhen, Guangdong, China​ | June 29th - June 30th, 2019



06.01.2019 ​| ​Abstract Submission Deadline

06.15.2019 ​| Acceptance Notification Deadline

06.01.2019 ​| Hotel  Reservation Deadline

06.09.2019 | Early Registration Deadline

06.29 - 06.30 2019 ​| Conference date

★  06.12.2019 | Poster Submission Deadline

The major areas of activity in the flexible and stretchable electronics solicited and expected at this symposium include but are not limited to:

  • Soft and bio-inspired materials: New properties and functions enabled by deformation or soft materials
  • 2D materials and devices: Synthesis and electronic and optoelectronic applications
  • Mechanical design: Mechanics and reliability
  • Advanced manufacturing: Advanced Printing, IC packaging, Transfer Printing
  • Applications: Wearable electronics, Health care, Compliant energy sources, Flexible display, Smart skin, Soft robotics
  • Instrumentation 

Presentation and Recommendation

High quality papers from this symposium will be selected to be published in a special issue of MDPI

Micromachines Journal